According to a report by the German tech site, Igor’s Lab, Alder Lake-S’ chipset isn’t just shipping out with a larger LGA1700 chipset – codenamed Socket V – but it will also be the first socket to house a completely new processor design in a long time. Specifically, blueprints obtained by the German publication point at Socket V supporting a processor with a rectangular design. Further, the Z-Stack, which is the total height of the CPU package, will be lower by approximately 1mm.
Not only that, but Igor also seems to have stumbled upon a set of blueprints that point to a new cooler that seemingly makes use of the high-performance thermoelectric cooling technology. This isn’t the first time such a cooler has made headlines; with its LGA1200 chipset, Intel partnered up with Cooler Master to create and launch the MasterLiquid ML360 Sub-Zero cooler.
Igor also managed to get his hands on schematics that seem to detail a low-profile reference cooler that look like they could be bundled with the lineup’s mid-range and entry-level processors at launch. Naturally, given the increased die size and pin density, it is very unlikely that this cooler will be backwards compatible with LGA1200 chipsets. (Source: Igor’s Lab via Videocardz // Image: Videocardz)
