Alongside the bump in general tasks performance, the Helio P70 also features up to 30% boost in AI calculations as well. The 12nm chip uses the same manufacturing process as the previous generation, but has a higher clock speed. Eight cores – four Cortex-A73, plus four Cortex-A53 modules makes up the SoC.
Baked into the SoC as well are three image signal processors (ISP), giving the Helio P70 power to handle dual 24+16MP camera setups or up to a single 32MP camera. It is also a global SoC, with the built-in modem capable of supporting two SIMs, VoLTE and multiple LTE bands from across the world. Power management has also been improved with the Helio P70, consuming up to 35% less power use in popular games compared to the P60. It also supports up to 8GB of LPDDR4X RAM for phones looking for larger RAM on board. You can expect phones with the new MediaTek Helio P70 to arrive sometime at the end of 2018 or early 2019. (Source: GSMArena, MediaTek)
